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IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 1453–1472, Yu B, Pan D Z. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Layout decomposition with pairwise coloring for multiple patterning lithography. Characterization and decomposition of self-aligned quadruple patterning friendly layout. Meeting the stringent requirements using low-tolerance components and cost constraints demanded of mobile wireless and handset components has required a laser-like focus on long term reliability and design-for-manufacturability (DFM). In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. 1-D cell generation with printability enhancement. Design for Manufacturability and Reliability for TSV-based 3D ICs David Z. Pan1, Sung Kyu Lim 2, Krit Athikulwongse , Moongon Jung , Joydeep Mitra 1, Jiwoo Pak , Mohit Pathak2, and Jae-seok Yang1 1 Department of ECE, University of Texas at Austin, Austin, TX, USA 2 School of ECE, Georgia Institute of Technology, Atlanta, GA, USA dpan@ece.utexas.edu, limsk@gatech.edu 57–64, Tian H T, Du Y L, Zhang H B, et al. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2011. 70: 6, Pain L, Jurdit M, Todeschini J, et al. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. Double patterning lithography aware gridless detailed routing with innovative conflict graph. 486–491, Xie J, Narayanan V, Xie Y. Mitigating electromigration of power supply networks using bidirectional current stress. Triple patterning lithography aware optimization for standard cell based design. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2007. 325–332, Chen X D, Liao C, Wei T Q, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. DFM Design for Manufacturability Valor Trilogy Valor NPI service 24 to 48 hours turn component coverage limited to current Valor library (30+ million parts) footprint design reduce assembly rework and enhances long term reliability DFM&R75 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. 208–213, Chien H-A, Han S-Y, Chen Y-H, et al. This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. Impacts of random telegraph noise (RTN) on digital circuits. Methodology for standard cell compliance and detailed placement for triple patterning lithography. Proc SPIE, 2015: 9427, Xu X Q, Cline B, Yeric G, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Reliability aware gate sizing combating NBTI and oxide breakdown. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. 344–349, Maly W, Lin Y W, Sadowska M M. OPC-free and minimally irregular IC design style. Minimize spare parts inventory is just one benefit. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. 1–7, Zhang H B, Du Y L, Wong M D, et al. Multi-patterning lithography aware cell placement in integrated circuit design, 2013. A feasibility study of rule based pitch decomposition for double patterning. An effective triple patterning aware grid-based detailed routing approach. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2011. And the design specifications directly affect the manufacturability of the board. 545–550, Ding D, Torres J A, Pan D Z. China Inf. Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. Design for Manufacturability (DfM) Seminar. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2014. Physics-based electromigration assessment for power grid networks. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2006. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. 370–375, Yang X, Saluja K. Combating NBTI degradation via gate sizing. Physical layout design of directed self-assembly guiding alphabet for IC contact hole/via patterning. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2007. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. The wrong design can result in additional costs associated with rework and repairs, production delays for increased lengths of time-to-market, and a poor-quality final product. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. Optimally minimizing overlay violation in self-aligned double patterning decomposition for row-based standard cell layout in polynomial time. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 34.1.1–34.1.4, Zou J B, Wang R S, Gong N B, et al. Design for Manufacturability (DFM) is a system approach that simultaneously considers all of the design goals and constraints for products that will be manufactured. 283–289, Ma Q, Zhang H B, Wong M D F. Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology. Proc SPIE, 2011: 7974, Gao J-R, Pan D Z. o Reliabilityis the measure of a product’s ability to o …perform the specified function o …at the customer (with their use environment) o …over the desired lifetime o Design for Reliabilityis a process for ensuring the reliability of a product or system during the design stage before physical prototype In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Adding the missing time-dependent layout dependency into device-circuit-layout co-optimization: new findings on the layout dependent aging effects. One of the biggest factors is the manufacturability … By Jamil Kawa, R&D Group Director, Synopsys, Inc. Introduction. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. Accurate process-hotspot detection using critical design rule extraction. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2015. This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. 267–272, Du Y L, Ma Q, Song H, et al. DSA template mask determination and cut redistribution for advanced 1D gridded design. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. Macromolecules, 2013, 46: 7567–7579, Yi H, Bao X-Y, Zhang J, et al. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. 161: 6, Ebrahimi M, Liang C, Asadi H, et al. Efficient process-hotspot detection using range pattern matching. Impact of a SADP flow on the design and process for N10/N7 metal layers. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2013. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. Apply to Engineering Manager, Director of Quality Assurance, Automation Engineer and more! Concept of reliability engineering Double patterning layout decomposition for simultaneous conflict and stitch minimization. © 2020 Springer Nature Switzerland AG. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 778–793, Lin Y B, Yu B, Xu B Y, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. Designing RF-MEMS has not been without its challenges. 17–24, Xiao Z G, Du Y L, Tian H T, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 939–952, Yuan K, Yang J-S, Pan D Z. Stitch aware detailed placement for multiple e-beam lithography. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. Constrained pattern assignment for standard cell based triple patterning lithography. Part of Springer Nature. J Appl Phys, 1999, 86: 3068–3075, Pak J, Lim S K, Pan D Z. Electromigration study for multiscale power/ground vias in TSV-based 3-D ICs. 789–794, Xiao Z G, Zhang H B, Du Y L, et al. IEEE Trans Dev Mater Reliab, 2005, 5: 405–418, Reviriengo P, Bleakly C J, Maestro J A. IEEE Trans Depend Secur Comput, 2012, 9: 770–776, Jiang I H-R, Chang H-Y, Chang C-L. WiT: optimal wiring topology for electromigration avoidance. Cite this article. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. http://www.cadence.com, Synopsys IC Validator. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. Block copolymer directed self-assembly (DSA) aware contact layer optimization for 10 nm 1D standard cell library. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. 123–129, Hsu P-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on conflict graph pre-coloring. Machine-learning-based hotspot detection using topological classification and critical feature extraction. Effective product development must go beyond the traditional steps of acquiring and implementing product and process design technology as the solution. Automated full-chip hotspot detection and removal flow for interconnect layers of cell-based designs. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. 502–507, Cho H, Cher C-Y, Shepherd T, et al. Proc SPIE, 2007, 6521, Kahng A B, Park C-H, Xu X. J Electrochem Soc, 2005, 152: G45–G49, De Orio R L, Ceric H, Selberherr S. Physically based models of electromigration: from Black’s equation to modern TCAD models. 201: 6, Peng H-K, Wen C H-P, Bhadra J. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2009. Self-aligned double patterning aware pin access and standard cell layout cooptimization. 65–66, Bita I, Yang J K W, Jung Y S, et al. Proc SPIE, 2015: 9427, Mirsaeedi M, Torres J A, Anis M. Self-aligned double-patterning (SADP) friendly detailed routing. 601–606, Xu Y, Chu C. A matching based decomposer for double patterning lithography. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. A polynomial time exact algorithm for self-aligned double patterning layout decomposition. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. Aging-aware logic synthesis. Fast yield-driven fracture for variable shaped-beam mask writing. There are many factors influencing the product design resulting in a profitable business. Proc SPIE, 2015: 9427, Chava B, Rio D, Sherazi Y, et al. Sci. 38–43, Chakraborty A, Pan D Z. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. The Design for Manufacturability Auditor discussed in this paper illustrates the application of an integrated knowledge-based/CAD system to assist in producing a design that adheres to preferred manufacturing practices. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2009. Timing yield-aware color reassignment and detailed placement perturbation for bimodal cd distribution in double patterning lithography. A new graph-theoretic, multi-objective layout decomposition framework for double patterning lithography. 17 Design Reliability Manufacturability Coach jobs available on Indeed.com. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. In: Proceedings of Symposium on VLSI Technology (VLSIT), Honolulu, 2012. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. Device/Circuit co-design in nanoscale CMOS technology about Institutional subscriptions, Moore G E. lithography and the best Design... Matching based decomposer for triple patterning lithography aware optimization for unidirectional Design and Utilizing... For reliability in nanometer CMOS on logic circuits hotspots with a unified approach for triple patterning lithography of NBTI scaled... Cell-Based row-structure layout Santa Clara, 2011, Automation and Test in Eurpoe ( DATE ), Santa,! 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